i did in fact add to the radiators. i added about 1/3 more. it was too iffy to solder the parts. copper heat pipes melting point is about the same as the solder. i opted for a custom thermal adhesive instead. i mixed it in a 2 parts thermal compound (antec nano diamond formula 7), to a 3 parts devcon 2 part clear (low viscosity ) epoxy ratio. adding the extra copper to the heatsinks required me to modify the whole motherboard tray, as i also was going to add 2 fan to directly cool the thicker heatsinks. i will provide some temperature tests soon . i been really busy lately