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ajc9988

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Everything posted by ajc9988

  1. So, an update on not all RAM is created equal. I recently purchased some G.Skill 2133MHz 11-11-11-31 ram that was manufactured in August. I, once again, overclocked a 2133MHz set to 2400MHz, this time with 12-13-13-31-278 CR2. After comparing the results, I stayed with the Kingston set I previously flashed. The interesting thing was that AIDA64 had the G.Skill winning on speed. So did winsat mem. It was a slim win, but a win nonetheless (except on latency in AIDA64). But, even with this, it lost in MaxxMem2 and (where it really counts) SuperPi32M (by over 2 seconds)! Fully attribute the loss to the latency, but here are the pics!Kingston G.Skill So, is seems I forgot to do screenshots of the SuperPi32M runs, BUT, the results were Kingston at 7M14.xxxS and G.Skill at 7M16.8xxS. Now, this is with a full CL setting slower AND much HIGHER tRFC (278 vs 228 on the Kingston). I wanted to point this out so that people would know, NOT ALL MEMORY IS CREATED EQUAL! My BIOS settings for 2400MHz on the G.Skill kit to follow (it was a 4x8GB Kit)...
  2. So, can you SPD flash G.Skill sodimms with Thaiphoon Burner. I'm considering picking up a 32GB (4x8GB) 2133 G.Skill, but need to know I can flash them. They use samsung chips whereas my current 4x8GB 2133 HyperX use Hynix and I have running at 2400 GHz 11-13-14-28-2N that I flashed on the SPD with TB. My scores are much higher than @mw86 and @timohour. I'm just wanting to know if I can manipulate the SPD and XMP profiles with G.Skill like I can Kingston before I purchase them. The slowest of them will be tightened at 2133 for my old P170HM while the faster running at 2400 (hopefully with tighter timings or with a faster speed) will be in my P770ZM.
  3. From what I read before I purchased them, you get a degree to a couple degrees over the 11W/mK pads, which do cool it more than stock. Instead of stacking, purchase in the appropriate height. If you need 3-4mm, I believe there is a 13W/mK available from fujipoly (can't remember what is available on the highest end for 2mm at the moment). Because of that, it depends on the setup. If you plan on sub-zero ambient or cooling it off where the cpu or gpu goes below 10C, then you will possibly open it up more often and want to use a standard TIM like ICD, Kryonaut, gelid extreme, etc., which increases the wear on thermal pads and 11W/mK makes more sense. If you are going liquid metal and setting it up to practically never open it again, or have less wear on the pads, 17W/mK makes sense as a one time cost. Considering you'll be opening it in the future to play with new video card bios, etc., you will want to consider how quickly you have worn out pads in the past. Fujipoly seems to be durable even on the 17W/mK for opening multiple times, but it comes back to how you decide when to change pads... Don't know if that helps... Sent from my SM-G900P using Tapatalk
  4. something you can do is use modeling clay or something similar to find the precise, minimum thickness of the pads needed (between some form of plastic to prevent it from getting on components). That is one solution. They also have a type of puddy tim that can be used... Sent from my SM-G900P using Tapatalk
  5. If you need a different thickness or size pad for fujipoly, contact performance-pcs.com. They'll order a different thermal pad made by fujipoly, including the 2, 3, 4, and even 5mm pads (5mm at 6w/mK, which is good for that thickness). Florida based company that I check out since frozencpu got in a funk... Sent from my SM-G900P using Tapatalk
  6. I agree on viewing angles, but more so for privacy. I also agree on 60hz except for 4K as it is still evolving and video cards can barely keep up... Sent from my SM-G900P using Tapatalk
  7. I know the 4K AUO had the connection positioned lower which could effect the lid on some models, or at least that is what was told to me when I was looking at it when it first came out. Other than that, and without knowing the position on the 1080p 120hz display, I absolutely agree. I also had doubts when being told the ZN couldn't fit it, but haven't tested and found out first hand. But, as I said, other than that, I fully agree. IPS are more consistent in color reproduction than NT displays. It is a question of accuracy and consistency over refresh rate and viewing angles. Also, I do not believe any of the very few displays offering 10-bit, 1.07B color are other than IPS or equivalent displays. Unfortunately, these displays use 50-pin eDP and Clevo uses 40-pin (and all that comes with that choice), so if more color is what you want over 16.7M, very few laptops can accommodate. Edit: most of the newer panels, whether IPS or NT are 8-bit these days. Go to panelook to get the specifics on the display you have or want to verify... Sent from my SM-G900P using Tapatalk
  8. What I do for compatibility is compare the physical dimensions and screw hole placements (as well as connector placements) with the original display our others known to work (changing this list on what works if the lid varies by company). If they are thinner than the original, but the outside is the same, shouldn't be an issue. You need as many matching screw mount points as possible and to make sure the connector and cord can attach without issue when closed. But I do agree, usually they can fit without issue, but connector position and cord length sometime means you have to do something to accommodate... Sent from my SM-G900P using Tapatalk
  9. If you didn't/couldn't buy from a partner shop, I guarantee nothing as I'm not the person with any say in the matter. But there are two ways to donate. 1) through PayPal (the link is on PremaMod.com). 2) there is a thread on nbr contributing to Prema's new laptop, a worthy project to give him one of the highest end laptops on the planet... If you appreciate his work, those options for donating are there. Check out his site for partner shops. Those are the ones that carry his bios... Otherwise, while donating, send a message to ask. This doesn't mean you will get what you want, nor that the gift is a transaction or conditional (conditioned upon receipt of the modified bios, which makes it like a transaction (I won't bore you with the legal and philosophical arguments of whether or not conditional gifts exist or whether they are transactions based on the occurrence of specific conditions))... Sent from my SM-G900P using Tapatalk
  10. I hook my laptop up to my 4K 50" tv for some games, giving me a reason to want the 1070 to get me by... If I only played internal display out only 1080, I'd definitely agree. But my wait could be as long as next summer/fall for Skylake-X, so the bit to upgrade now doesn't seem that bad a value for the interim... Broadwell-E runs its course in a year. The new socket for the X processors will run through cannonlake, so a good 3 years about if adopted immediately. That's about the best you can ask unless Zen is somehow magic since their socket is the same for their entire lineup moving forward... Sent from my SM-G900P using Tapatalk
  11. I'm just looking at a way to make mine bearable while saving up for a new rig. Limited funds and an expensive hobby... Even if I sold my rig now, I wouldn't quite have enough for a proper DM2, meaning either increasing the value and hoping it doesn't lessen too much by the time I sell it/can afford what I want. I meant doing what you can for your mobile ZM, not the being chapped about the DM, which is BS. With the size of the full 980, unless you got the 180W with mods our made your own (*hat tip to Khenglish*), you knew what your P750ZM was when you got it. I had less foresight as an early adopter (needed a new laptop for the bar exam, so got this at the time as the MB on my last machine burnt out). I don't mind lemonades, but if I had this machine and a P870, I wouldn't bench the ZM as much because I wouldn't get the scores I want... Until I can build the desktop I want or get the laptop with upgradable assurances, I figure do what I can... Sent from my SM-G900P using Tapatalk
  12. You get bonus points if you can throw a 1070 into a P700 series (the 980 and 1080 were never options with current cooling and size, unless doing what Khenglish did and throwing a 980 core on a 980m card, which may not work with the 10 series)... Sent from my SM-G900P using Tapatalk
  13. The grid is CHEAPER than the unified heatsink in the ZM! If it works so well, why don't they replace the zm and dm heatsinks with a straight vapor chamber (that's right, they'd have to make it with less variance and their QA with Foxcon sucks)... Sent from my SM-G900P using Tapatalk
  14. Don't forget with vapor chamber, you can't try to correct it yourself without higher risk of destroying the heat sink also! Sent from my SM-G900P using Tapatalk
  15. How much is a grid? Sent from my SM-G900P using Tapatalk
  16. Why OLED and not quantum dot? Color range is there with the dot, but I can't remember their respective response times... Sent from my SM-G900P using Tapatalk
  17. So who's going to get the mxm to pcie adaptor and bust out their ln2 pot for that msi card? Sent from my SM-G900P using Tapatalk
  18. Looks can be deceiving, but also without having a reference design anymore, msi may have an advantage in designing cards because of experience with aftermarket desktop oc cards. Then again, if it runs so hot already, why build it out for overclocking ability when you know it is heat limited no matter what you do? Just playing devil's advocate... Sent from my SM-G900P using Tapatalk
  19. While its nice that laptops are getting gpu hardware as close to desktop stuff as ever, I overall am not liking this change in laptop cards starting with the 980 notebook. Upgrading seems dead. While standard mxm cards were overpriced, the cost of these custom mxm cards is just nuts. Prices for the 980 notebook cards were over $1200, and I don't expect the 1080 to be any less than that. We used to have Dell, MSI, and Clevo all making standard and mostly interchangeable cards. Now Clevo and MSI are incompatible and Dell seems to have disappeared. I'd rather have slightly weaker, but much cheaper and upgradable GPUs than slightly stronger and much more expensive and unupgradable GPUs. Right now they still use the old standard mxm slot so some laptops can probably use new cards with modified laptop cases and heatsinks, but I expect that to be dropped next gen fully killing gpu upgrades. It would be great is MSI and Clevo got together and aggreed on a mobile GPU standard that they would try to continue for several generations. I agree. I just wish they not only got together on the cards, but on everything to create even better modularity and ability for aftermarket parts. Specifically, a standard board like itx or atx, etc, meaning heatsinks that are similar in size our shape, but where manufacturers could tweak designs or components to fit in the same area, giving choice for upgrades in cooling and also cooling fans. Video cards are part of it, but keeping your case and upgrading MB and components would be awesome, our being able to transfer your current system to a better chassis because of universal size/shape for how it fits. You make boards for slim chassis and mark compatibility and sizes. The point is, process won't drop on components, even for upgradeable units, with so little competition! They see the laptop as a unit and want consumers to as well. I want the components to be viewed as the unit and fully upgradeable. But I do agree, let's get video card upgrade back first... Sent from my SM-G900P using Tapatalk
  20. If only the industry would settle on a similar standard on shape like mxm did and create an aftermarket of both heatsinks and cards like desktops! That is where the industry needs to move to! Standard MB and component placement, heatsink, and videocard. Maybe have extended space on certain laptop models advertised as such for oversized cards like you would have to pick a case for a desktop to hold the oversized video cards. A man can dream of a day for just buying a "case" (chassis), display, mb, cpu (desktop chips for all, allowing for low power desktop chips (which now have tdp matching mobile sockets, or full bore chips), gpu, heatsink, ram, etc. And building it from scratch, upgrading as desired, buying his preferred manufacturer on each component. This is where modular laptops need to go! Then laptop manufacturers would also need to compete on quality of each component and you would have high end, highly customized machines! :-) Sent from my SM-G900P using Tapatalk
  21. Thank you sir @Mr. Fox as a broke engineer, i must agree stretching the already stretched wallet is better in the long run for the sake of keeping the components cool and healthy. The only thing that itch me is the fact that P870DM-2 can't do sli 1080 so why bother having it more expensive. However, if in the end i will pull the trigger on it, i hope @Prema guru will enlighten us by revealing that we can buy the "grid", another 1080 and fit it in P870DM-2 , or if DM-3 will have option for single 1080. because some people can't spend 4000$ in 1 shot. 2.5K now and 1.2-1.5K later is more reasonable [emoji3] . I will wait until that further notice of SLI-ability of 1080 in DM-2 or single option 1080 for DM-3. I think resellers are abusing price of P870DM-3 for this 1080 capability as of now. Now what i wonder more is whether this 1080 in laptop can overclock past that 2.1GHz desktop barrier [emoji3] The dm3 and dm2 price difference is $1200. The 1080 costs about $1050. The grid also had a cost unknown and not compared to the other heatsink. As such, doesn't seem as an abuse, tbh. Sent from my SM-G900P using Tapatalk
  22. Until the OEMs (Clevo and others) can get closer to achieving aerospace precision, I think a spaghetti labyrinth made this way is going to be a frequent hit or miss proposition. The last thing a customer that paid big bucks for an expensive product should have to deal with is wide variances in quality that affect fit and functionality. With some luck you might have success tweaking a deformed setup like this, but that is going to be hit or miss and could make matters worse. The slightest amount of variance in fit can have a large adverse impact on thermal management. The thought process has merit, but so far the execution always seems to leave something to be desired. I definitely agree, but want you to also see the difference of our heatsink and the 750dm2 Which looks designed better? Sent from my SM-G900P using Tapatalk
  23. Until OEMs (Clevo and others) can get What sucks is this is designed for the new Clevo cards = no compatibility for us. If they made a similar upgrade heatsink for the old machines, I'd buy it in a heartbeat. It saddened me greatly when I realized the gpu side won't work in our machines at all!!! Also, the gpu side doesn't seem to have the thickness of the cpu side, hence why I thought cpu has vapor chamber but gpu doesn't. I hope they put one out for us with the new design though (or why I mentioned get a custom fabricated one with a similar design)... Sent from my SM-G900P using Tapatalk
  24. I don't know it is a vapor chamber, just praying it is. But they went to a spring bar and straight screws with more heat pipe coverage, it seems... Sent from my SM-G900P using Tapatalk
  25. I both agree and disagree on the unified heatsink. I studied the design we have and mistakes were made. They focused running the heat pipes over the heat source, which is intuitive, but if you look at the new design, it changed. They, with the new design, went for maximizing surface contact with the heat pipes rather than focusing on the localized heat source. This also suggests they may have switched to a vapor chamber over the cpu instead of a metal plate which requires maximizing the contract over the heat source, as well as going to heat pipes that are larger and can move significantly more heat then three uniform medium size heat pipes. So, if the changes I believe were made were made, the cooling capacity may be more than what we have. With clu, if it works properly on cooling, you only have to repaste every couple years. Plus, even though separate, the dm3 requires you to pull the grid if you need to deal with the cpu. But hope that helps on some thoughts I had. The new 750/775dm heat sinks look to have switched to straight screw (or don't look like spring screws from the pics to me) and the height doesn't look like a regular plate that the pipes sit on, looking closer to the grid type top. I really want someone to tell me more about those sinks!!! Sent from my SM-G900P using Tapatalk
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