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After acquiring Infineon’s wireless business, Intel announced today at the Mobile World Congress it’s newest XMM 6260 platform. The new 3G chip is purported to be versatile enough to be used as a standalone in for PC modem and data cards or in tandem with a smartphone’s application processor.
So how fast is the XMM 6260? According to Intel, the HSPA+ technology supports up to 21 Mbps download and 11.5Mbps uplink speeds. This XMM 6260 will be produced by Asian manufacturers rather than by Intel itself and is currently shipping.
Intel also unveiled a new XMM 7060 platform which supports LTE/3G/2G that is designed for mobile handsets, embedded solutions and data cards/dongles. Expect to see the XMM 7060 during the second half of 2012.
Source: First Intel-branded 3G, LTE chips debut | Nanotech – The Circuits Blog – CNET News.
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